Resin Bond Products

Diamond back grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with less subsurface damage.

During grinding, the grinding wheel and the wafer rotate about their own rotation axes simultaneously, and the wheel is fed towards the wafer along its axis. The rotation axis for the grinding wheel is offset by a distance of the wheel radius relative to the rotation axis for the wafer.